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Hyper A+ Server AS -2125HS-TNR

(AS -2125HS-TNR)
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2U Hyper with 24 hot-swap 2.5″ NVMe/SATA bays and 1 PCIe 5.0 x16 slot

Key Features

  1. Dual AMD EPYC™ 9004/9005* Series Processors
    (*AMD EPYC™ 9005 series drop-in support requires board revision 2.xx)
  2. Support up to DDR5 24 DIMM slots (1DPC), speed up to 6400MT/s
    (Please check System Memory Section for detail)
  3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots or mix and match
    Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
  4. 24 Hot-swap 2.5″ NVMe/SATA/SAS drive bays
    2 M.2 PCIe 3.0 NVMe slots
  5. Dual 1600W Redundant Titanium Level power supplies
    (Power supply full redundancy based on configuration and application load)
MSRP*
N/A

* Manufacturer’s Suggested Retail Price

Product Specifications

System Features
CPU
Core Count
  • Up to 320C/640T
Note
  • Supports up to 400W TDP CPUs *
  • *Air Cooled CPUs with TDP over 290W only supported under specific conditions. Contact a Supermicro representative for details.
Max GPU Count
    • Up to 3 double-width GPUs


Supported GPU
    • NVIDIA PCIe: H100, L40S

Memory
    • Slot Count: 24 DIMM slots
    • Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM (AMD EPYC™ 9004 Series Processor, MB R1.x/R2.0/R2.01)
    • Max Memory (1DPC): Up to 6TB 6000MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor, MB R2.0)
    • Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM (AMD EPYC™ 9005 Series Processor, MB R2.01)

Memory Voltage
    • 1.1V


Chipset
    • System on Chip


Network Connectivity
    • Via AIOM

LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 USB 3.0 ports(rear)
Video
  • 1 VGA port
BIOS Type
  • AMI 32MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.4
  • Plug and Play (PnP)
  • SMBIOS 3.5 or later
  • UEFI 2.8
  • USB Keyboard support
Software
Power configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
  • Power button override mechanism,
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Voltage
  • System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support
Form Factor
  • 2U
Model
  • CSE-HS219-R1K63P-A
Height
  • 3.5″ (88.9 mm)
Width
  • 17.2″ (437 mm)
Depth
  • 29.9″ (760 mm)
Package
  • 10.4″ (H) x 23.8″ (W) x 43.6″ (D)
Weight
  • Gross Weight: 72 lbs (32.7 kg)
  • Net Weight: 39 lbs (17.7 kg)
Available Color
  • Black front & silver body
LED
  • HDD activity
  • LAN1 activity
  • Power status
  • System information
Buttons
  • Power On/Off
  • UID button
PCI-Express (PCIe) Configuration
    • Default
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option A*
      • 1 PCIe 5.0 x16 (in x16) FHFL double-width slot
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option B*
      • 2 PCIe 5.0 x8 (in x16) FHFL slots
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option C*
      • 2 PCIe 5.0 x16 (in x16) FHFL double-width slots
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option D*
      • 1 PCIe 5.0 x16 (in x16) FHFL double-width slot
      • 2 PCIe 5.0 x8 (in x16) FHFL slots
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option E*
      • 4 PCIe 5.0 x8 (in x16) FHFL slots
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option F*
      • 4 PCIe 5.0 x16 (in x16) FHFL double-width slots
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option G*
      • 3 PCIe 5.0 x16 (in x16) FHFL double-width slots
      • 2 PCIe 5.0 x8 (in x16) FHFL slots
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option H*
      • 2 PCIe 5.0 x16 (in x16) FHFL double-width slots
      • 4 PCIe 5.0 x8 (in x16) FHFL slots
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • Option I*
      • 1 PCIe 5.0 x16 (in x16) FHFL double-width slot
      • 6 PCIe 5.0 x8 (in x16) FHFL slots
      • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
    • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)

Drive Bays Configuration
    • Default: Total 24 bays
      • 24 front hot-swap 2.5″ NVMe*/SAS*/SATA* drive bays
    • (*NVMe/SAS/SATA support may require additional storage controller and/or cables)

M.2
    • 2 M.2 PCIe 3.0 x4 NVMe slots (M-key 2280/22110)

Fans
  • Up to 4x 8cm heavy duty fans with optimal fan speed control
System Cooling
Fans
  • Up to 4x 8cm heavy duty fans with optimal fan speed control
Air Shroud
  • 2 Air Shrouds
Air Shroud
  • 2 Air Shrouds
2x 1600W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 265 mm
Input 1000W: 100-127Vac
1000W: 100-127Vac / 50-60Hz
1600W: 200-240Vac
1600W: 200-240Vac / 50-60Hz
1600W: 200-240Vdc / 50-60Hz (for CQC only)
+12V Max: 83.3A / Min: 0A (100Vac-127Vac)
Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB Max: 3.5A / Min: 0A
Max: 3.5A
Output Type Backplanes (gold finger)
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)

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