Key Features
1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 4 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slots, support 5 low-profile AOCs
4. 8x 2.5″ SAS3 & 8x 2.5″ SATA3 Hot-swap Drive Bays, optional DVD-ROM drive, optional support 2 NVMe/SSD/HDD 2.5″ fix drives, 1 M.2 support
5. M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
6. 2x 1GbE LAN ports with Intel® X722
7. Integrated IPMI 2.0 with KVM and Dedicated LAN
8. 2 SuperDOM, 1 VGA, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A
9. 3 Heavy duty 8cm fans with PWM fan speed and cooling zone control
10. 1200W Redundant Power Supplies Titanium Level (96%)
* Manufacturer’s Suggested Retail Price
| CPU |
|
| Cores |
|
| Note | ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R) |
| Memory Capacity |
|
| Memory Type |
|
| Note | † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro †† Cascade Lake only. Contact your Supermicro sales rep for more info. |
| Chipset |
|
| SATA |
|
| SAS |
|
| Network Controllers |
|
| IPMI |
|
| Graphics |
|
| SATA |
|
| SAS |
|
| LAN |
|
| USB |
|
| Video |
|
| Serial Port / Header |
|
| BIOS Type |
|
| Software |
|
| Power Configurations |
|
| CPU |
|
| FAN |
|
| Temperature |
|
| Form Factor |
|
| Model |
| Height |
|
| Width |
|
| Depth |
|
| Package |
|
| Weight |
|
| Available Color |
|
| Buttons |
|
| LEDs |
|
| PCI-Express |
|
| Hot-swap |
|
| Peripheral |
|
| Optional |
|
| Fans |
|
| 1200W Redundant Power Supplies with PMBus | |
| Total Output Power |
|
| Dimension (W x H x L) |
|
| Input |
|
| +12V |
|
| +5Vsb |
|
| Output Type |
|
| Certification | [ Test Report ] |
| RoHS |
|
| Environmental Spec. |
|
(855) 272-5044