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WIO SuperServer SYS-512B-WR

(SYS-512B-WR)
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1U UP WIO with 4 hot-swap 3.5” NVMe/SAS/SATA bays and 3 PCIe 5.0 slots

Key Features

  1. WIO systems offer flexible I/O configurations in a cost-effective architecture to deliver truly optimized systems for specific enterprise requirements.
  2. Single Intel® Xeon® 6 Processor
  3. 8 DIMM slots supporting up to 2TB of memory
  4. Tool-less, Top-loading riser design support 3 PCIe 5.0 Expansion (2x FHFL + 1x LP).
  5. Native SATA drives supported, with option PCIe 5.0 NVMe and SAS.
  6. Trusted Platform Module (TPM) 2.0 onboard.
MSRP*
N/A

* Manufacturer’s Suggested Retail Price

Product Specifications

System Features
CPU
Core Count
  • P-cores: Up to 86C/172T; Up to 336MB Cache
  • E-cores: Up to 144C/144T; Up to 108MB Cache
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
Max GPU Count
    • Up to 1 double-width or 2 single-width GPUs


Supported GPU
    • NVIDIA PCIe: RTX 2000 Ada, RTX 4000 Ada Generation

CPU-GPU Interconnect
    • PCIe 5.0 x16 CPU-to-GPU Interconnect


Memory
    • Slot Count: 8 DIMM slots/8 Channels
    • Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM

Memory Voltage
    • 1.1V


SATA
    • SATA (6Gbps)


NVMe
    • NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)

Chipset
    • System on Chip


Network Connectivity
    • 2 RJ45 1GbE with Intel® I210

LAN
  • 2 RJ45 1 GbE LAN ports
  • 1 RJ45 1 GbE Dedicated BMC LAN port (IPMI shared on LAN port 1)
USB
  • 2 USB 3.2 Gen1 Type-A ports(rear)
  • 2 USB 3.2 Gen1 ports(Header)
Video
  • 1 VGA port
Serial
  • 1 COM port(Rear)
  • 1 COM port(Header)
TPM
  • 1 TPM header
BIOS Type
  • AMI 64MB SPI Flash EEPROM
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
  • 8 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Form Factor
  • 1U
Model
Height
  • 1.7″ (43 mm)
Width
  • 17.2″ (437 mm)
Depth
  • 25.6″ (650 mm)
Package
  • 8.5″ (H) x 23.5″ (W) x 33.7″ (D)
Weight
  • Gross Weight: 34.5 lbs (15.46 kg)
  • Net Weight: 21.5 lbs (9.75 kg)
Available Color
  • Black
LED
  • Fan Fail/System Over Heat LED
  • HDD activity LED
  • Network Activity LEDs
  • Power status LED
  • Unit Identification (UID) LED
Buttons
  • Power On/Off button
  • System Reset button
  • Unit Identification (UID) button
PCI-Express (PCIe) Configuration
    • Default
      • 2 PCIe 5.0 x16 FHFL slots
      • 1 PCIe 5.0 x8 (in x16) LP slot

Drive Bays Configuration
    • Default: Total 4 bays
      • 4 front hot-swap 3.5″ SAS*/SATA drive bays
    • Option A: Total 4 bays
      • 4 front hot-swap 3.5″/2.5″ PCIe 5.0 x4 NVMe*/SAS*/SATA drive bays
    • (*NVMe/SAS support may require additional storage controller and/or cables, please see the optional parts list for details)

M.2
    • 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110; VROC required for RAID)

Peripheral Bays
    • 2 slim peripheral bays


Fans
  • Up to 1 AOC cooling Fan(s) (optional)
  • Up to 5 middle cooling PWM 40x40x56mm Fan(s)
Air Shroud
  • 1 CPU Air Shroud
2x 860W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL)54.5 x 40.25 x 322 mm
Input800W: 100-127Vac / 50-60Hz
860W: 200-240Vac / 50-60Hz
860W: 240Vdc / 50-60Hz
+12VMax: 66.67A / Min: 0A (100Vac-127Vac)
Max: 71.67A / Min: 0A (200Vac-240Vac)
Max: 71.67A / Min: 0A (Vdc-240Vdc)
5V SBMax: 4A / Min: 0A
Output TypeBackplanes (gold finger)
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)

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